Die Attach Dispensing

Datacon Flip Chip Die Bonder is the leader from the very beginning, offers you the ideal system for series production in this highly sophisticated technology at very competitive prices. Through continuous product improvements and innovative research and development work, we have achieved a reputation as an international technological leader. Multiple international awards underline this claim.
Datacon has the reputation to consistently create innovative, dynamic, customer and market-specific strategies which lead to trendsetting product developments in the back-end assembly field of the Advanced Packaging Market. The Datacon North America, Inc. and Datacon Asia Pacific Pte. Ltd. subsidiaries handle marketing, sales and technical support in their respective regions.