Advanced Die Bonder

Datacon Flip Chip Die Bonder is the pioneer from the very start, brings to you the ideal system for series production in this highly sophisticated technology at very competitive prices. The Datacon North America, Inc. and Datacon Asia Pacific Pte. Ltd. subsidiaries handle marketing, sales and technical support in their respective regions.
Technological competence and outstanding customer service make Datacon an invaluable resource for semiconductor manufacturers throughout the world and the top-ranked assembly equipment supplier for customer satisfaction. We have detailed information on our website, also you can get in touch with any of our Customer service representative for assistance.