Flip Chip Die Attach Solution

Smaller, faster, cheaper � using the latest microelectronics is a prerequisite for rapidly improving the quality in many areas of life. Datacon�s semiconductor Flip Chip Die Attach products help consumer goods become cheaper and more compact.
Product Details - Datacon has concentrated on the advanced packaging market since 1986, focusing on die bonding and Flip Chip technologies. Datacon leads the way in these markets, guaranteeing our customers a future-oriented, customized solution. Don't be content with anything else!
Special Machines - The Special Machine section includes all special machines and "turn-key solutions" - Datacon specializes in providing highly complex technical solutions. This product group has been transferred out to the Eurotec subsidiary.
Training - It is the aim of Datacon to be able to offer not just the technology but also specific solutions for ist customers. A professional, three-person team of trainers instructs the customers in both German and English.